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Today MediaTek announced a follow-up in its SoC line-up with the new Dimensity 1000+. This seems to be a binned or revisioned variant of the Dimensity 1000 announced last year, although we currently lack details on the exact changes.

The Dimensity 1000+ is powered by 4x Cortex-A77 cores up to 2.6GHz and 4x Cortex A55 cores up to 2 GHz. Although we never saw any kind of Dimensity 1000 powered devices out there in the wild, we did manage to get our hands on an Oppo Reno 3 with a Dimensity 1000L – a lower binned variant of the flagship chip. 

Even this lower binned variant performed quite excellently, able to showcase higher performance as well as better power efficiency compared to competing SoCs such as the Snapdragon 765.

The GPU is a Mali G77MP9 – but again since we never saw the full featured D1000 in the wild we don’t know how the D1000+ will perform. The lower-binned D1000L certainly showcased good performance at excellent power consumption.

The SoC includes a 5G modem capable of sub-6GHz frequencies (which covers the vast majority of markets). The chip also currently is the only mobile chip this year that support AV1 hardware decoding, an interesting feature that makes MediaTek’s offerings more future-proof than other chipsets.

Today’s announcement generally seems a bit meagre on details on what the D1000+ provides over the D1000. Vivo’s iQOO is said to be designing a phone powered by the new chipset, which hopefully means we’ll finally see the full potential of the Dimensity 1000 SoC materialise.
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