Quote:AMD Ryzen 9000 CCD uses TSMC 4nm N4P node



AMD has released detailed information about the Zen5 manufacturing node and compute chiplet die sizes. This was part of the Zen5 Tech Day, which covered AMD’s next-generation architecture for desktops and mobile devices.

The company confirmed that the CCD, codenamed Eldora, fits up to 8 Zen5 cores and measures 70.6 mm², almost the same size as the Zen4 CCD, which is 71 mm². Despite the similar size, the architecture has been significantly revamped and will form the foundation for future Zen generations. While many specifications remain unchanged from Zen4 (same core count, same cache size), advancements in the manufacturing node have enabled AMD to integrate more transistors into the core design.

AMD continues to use the same IOD for the Ryzen 9000 processors as its predecessor, so there are no changes in that area. However, while Zen4 uses the TSMC 5nm FinFET node, Zen5 utilizes the TSMC 4nm FinFET node, specifically N4P. Although the exact number of transistors in the Zen5 chiplet has not been confirmed, unofficial sources suggest it contains 8.315 billion transistors. This results in a density of 117.78 MTr/mm², representing a 26.8% increase compared to Zen4.

Ryzen 9000 CCD vs. 7000 CCD

• Die Size: -0.005%
  
• CCD Transistor density : +26.8%
  

Ryzen AI 300 vs, 7040

• Die Size: +30.6%
  
• Transistors density: ?
  

AMD has also confirmed that Strix Point’s monolithic die will be 232.5 mm², which is 30.6% larger than its predecessor, Phoenix1. While the transistor count has not been officially confirmed, it’s worth noting that Strix Point will feature increased L2 and L3 cache and significantly larger graphics capabilities (16 CUs versus 12 CUs).
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