Posts: 14,543
Threads: 9,565
Thanks Received: 9,055 in 7,205 posts
Thanks Given: 9,838
Joined: 12 September 18
12 March 19, 08:43
(This post was last modified: 12 March 19, 08:44 by harlan4096.)
Quote:![[Image: ChipRebel9820_575px.png]](https://images.anandtech.com/doci/14069/ChipRebel9820_575px.png)
Every time a new SoC comes one, the one thing we eagerly await is for someone to release a die shot of the new chip. This process is most interesting when the new chip either comes with a new microarchitecture or a new process node. Last November, we covered the release of ChipRebel’s Kirin 980 die shot which gave us the first ever look of Arm’s new Cortex A76 CPU as well as Mali G76 GPU on a new 7nm process node.
The folks over there are at it again and have seemingly been very busy overnight, this time around tearing down the Galaxy S10 with the new Exynos 9820. I’ve been going back and forth with the ChipRebel team on these last two projects and they’re great guys, definitely visit them if you are in need of die shots.
8nm not as small as 7nm
The first thing standing out for the Exynos 9820 is the fact that at ~127mm², the chip has actually grown compared to the 10LPP Exynos 9810 of last year. Samsung’s 8LPP node isn’t as aggressive in scaling as TSMC’s 7nm process, and in theory the process node should bring a conservative 15% reduced area compared to its preceding node, leaving TSMC at a notable density advantage this generation. Compared to the Kirin 980 at 74.13mm², the Snapdragon 855 at 73.27mm² and even Apple’s A12 at 83.27mm², the new Exynos 9820 clearly stands out as out of line compared to the competition.
Continue Reading